Exchange of Views with the Senior Executives of the Global Semiconductor Companies
May 18, 2023
Prime Minister Kishida wrapping up a meeting (1)
Prime Minister Kishida wrapping up a meeting (2)
Prime Minister Kishida wrapping up a meeting (3)
Commemorative photo session
On May 18, 2023, Prime Minister Kishida exchanged views with the senior executives of the global semiconductor companies at the Prime Minister’s Office.
Following the exchange of views, Prime Minister Kishida said,
“Today we received explanations on collaborative investments with Japanese companies and cooperation in the development of next-generation semiconductors from the senior executives of the leading overseas semiconductor and computing companies.
I express my sincere appreciation for your valuable briefings. Since the inauguration of my administration, I have strived to achieve the revival of the Japanese semiconductor industry and expand investments in Japan. In this regard, I am very pleased about your positive attitude expressed today toward making investments in Japan.
While drawing on your explanations today, we will make government-wide efforts to further increase direct investments in Japan and provide support for the semiconductor industry.
This is the basic policy of the Japanese government, which we intend to incorporate into the ‘Big-Boned Policy.’
And today, I am going to leave for Hiroshima, the venue of the G7 Hiroshima Summit, after this exchange of views. As the G7 Presidency holder, Japan will lead discussions and strengthen global collaboration on an international challenge of stabilizing global supply chains.
Let me conclude my remarks by once again extending my gratitude for your valuable briefings and expressing my great expectations for additional investments in Japan. Thank you very much.”